Počet kreditů 4
Vyučováno v Winter
Rozsah výuky 2P+2L
Garant předmětu
Přednášející
Cvičící

Printed circuit boards and modular constructions. Single sided, double sided and multi-layer boards. Through-hole and surface mount technologies. Designing printed circuits patterns. Passive and semiconductor components for electronic circuits. Manual and automated assembly. Soldering techniques. Testing of printed circuit boards during the manufacturing.

The credit reguirements: seminar presentation, realization of electronic circuit, protokol of circuit realization and the student must obtain minimally 50 % of avaliable points in the tests.

A student are well-educated of properties of fundamental electronic devices, theit application at realization of electronic circuits, technology of ralization of PCB and methods of actuating of electronic equipment

1. Realization methods of electronic circuits
2. Design technique of real circuits
3. Printed circuits board technologies and component bonding
4. Practical design of printed circuits boards
5. Computer design
6. Passive components - specific properties
7. active components - specific properties
8. Power supplies for electronic circuits, design, realization
9. Component assembly. Soldering technique
10. Switching and wiring components
11. Putting into operation, testing
12. Selection of measuring methods and apparatus
13. Design effect on equipment reliability
14. Basic Standards for electronic equipments

1. Introduction. Safety provisions. Catalogue of components
2. Methods of realization electronic circuits
3. Printed circuits boards design
4. Computer - aided program Formica
5. Computer - aided program Formica
6. Electronic circuits realization - scheme
7. Electronic circuits realization - function verification
8. Electronic circuits realization - printed circuits boards
9. Component assembly
10. Electronic circuits realization - soldering
11. Circuits function testing
12. Circuits parameters measuring
13. Final report
14. A credit

[1] Leonida, G., Handbook of Printed Circuit Design, Manufacture Components & Assembly. Electrochemical Publications, IOM, 2000

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