CTU FEE Moodle
Manufacturing of Electronic Equipment
B232 - Summer 23/24
Manufacturing of Electronic Equipment - B1B13VEZ
| Credits | 6 |
| Semesters | Summer |
| Completion | Assessment + Examination |
| Language of teaching | Czech |
| Extent of teaching | 2P+2L |
Annotation
(obsolete text, currently valid is czech version) Mechanical and electrical design. The electric contact. Joining of conductors. Cooling of components and equipment. Printed circuit boards fabrication. Soldering in electronics. Electromagnetic compatibility of electronic equipment. Protection of components and equipment sensitive on electrostatic field. Certification, accreditation, quality control and quality assurance.
Study targets
(obsolete text, currently valid is czech version) Survey of modern methods of production of electronic devices capable of competition.
Course outlines
(obsolete text, currently valid is czech version)
1.Mechanical and electrical design of electronics equipment
2.Electrical contacts. Basic feature. Application.
3.Mechanical, metallurgical and adhesive joints in electronics
4.Influence of environmentalism on construction and materials of joints.
5. PCBs of different types including flexible PCBs
6. Assembly in electronics - THT
7. Assembly in electronics - SMT
8.Production facility for assembly electronics
9. Temperature conditions of components and equipment. Thermostats, cooling, heat pipe.
10.Manufacturing, operating and working environment.
11. Protection of components and equipment sensitive on electrostatic discharge
1.Mechanical and electrical design of electronics equipment
2.Electrical contacts. Basic feature. Application.
3.Mechanical, metallurgical and adhesive joints in electronics
4.Influence of environmentalism on construction and materials of joints.
5. PCBs of different types including flexible PCBs
6. Assembly in electronics - THT
7. Assembly in electronics - SMT
8.Production facility for assembly electronics
9. Temperature conditions of components and equipment. Thermostats, cooling, heat pipe.
10.Manufacturing, operating and working environment.
11. Protection of components and equipment sensitive on electrostatic discharge
Exercises outlines
(obsolete text, currently valid is czech version)
1.Safety of operation in laboratories. Instructions of tasks.
2.Joints, jointing in electronics.
3.Electromechanical contact systems.
4.Measurement of contact resistance of contacts.
5.Fabrication of solder and adhesive joints.
6. Measurement of parameters of soldering and adhesives joints.
7.Electrostatic discharge sensitive components (ESDS).
8.Measurement of temperature in electronic equipment
9.Visit to factory: manufacturing of electronics equipment.
10. Video demonstration - product equipment .
11. Mounting and repair PCB - manufacturing samples - part 1.
12. Mounting and repair PCB - manufacturing samples - part 2.
13.Shielding technology - demonstration and measurement of samples.
14.Evaluation of reports from measurements. A credit.
1.Safety of operation in laboratories. Instructions of tasks.
2.Joints, jointing in electronics.
3.Electromechanical contact systems.
4.Measurement of contact resistance of contacts.
5.Fabrication of solder and adhesive joints.
6. Measurement of parameters of soldering and adhesives joints.
7.Electrostatic discharge sensitive components (ESDS).
8.Measurement of temperature in electronic equipment
9.Visit to factory: manufacturing of electronics equipment.
10. Video demonstration - product equipment .
11. Mounting and repair PCB - manufacturing samples - part 1.
12. Mounting and repair PCB - manufacturing samples - part 2.
13.Shielding technology - demonstration and measurement of samples.
14.Evaluation of reports from measurements. A credit.
Literature
1 Hwang, J. S. Modern Solder Technology for Competetive Electronics
Manufacturing. McGraw-Hill, New York 1996.
2 Sung Jim Kim, Sang Woo Lee. Air Cooling Technology for Electronic
Equipment. CRC Press, Inc. New York. 1996
3 Lee, Ning-Cheng: Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies, Newnes, Butterworth-Heinemann, USA, 2002
Manufacturing. McGraw-Hill, New York 1996.
2 Sung Jim Kim, Sang Woo Lee. Air Cooling Technology for Electronic
Equipment. CRC Press, Inc. New York. 1996
3 Lee, Ning-Cheng: Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies, Newnes, Butterworth-Heinemann, USA, 2002
Requirements
(obsolete text, currently valid is czech version) A student has to obtain a credit before an examination.