CTU FEE Moodle
Integrated System Structures
B232 - Summer 23/24
This is a grouped Moodle course. It consists of several separate courses that share learning materials, assignments, tests etc. Below you can see information about the individual courses that make up this Moodle course.
Integrated System Structures - B2M34SIS
Main course
| Credits | 6 |
| Semesters | Winter |
| Completion | Assessment + Examination |
| Language of teaching | Czech |
| Extent of teaching | 2P+2C |
Annotation
Student learn main design methodologies of analog, digital and optoelectronic integrated systems; Detailed description of the technological process for the IC production; CMOS technologies and its advanced sub-micron trends; IC chip topology, layout and design rules; Technology of micro-electro-mechanical systems MEMS.
Study targets
Students will understand the problems of the design of integrated circuits and integrated systems.
Course outlines
1. Historical overview of the development of integrated systems and integrated circuits, design methodologies, perspective trends.
2. Methodology of analog, digital and mixed-signal integrated systems (top down, bottom up), the design abstraction levels, Application Specific Integrated Systems ASIC - principles of ASIC hierarchy, comparing the performance, economics aspects
3. Fabrication integrated circuits processes - materials, wafer preparation, types of lithography (DUV, EUV, electron, X-Ray), etching (plasma, RIE)
4. Fabrication integrated circuits processes - ion implantation, diffusion, epitaxial growth, chemical vapor deposition CVD, PVD, planarization, copper metallization, ICs packaging and testing.
5. The CMOS process technology step by step, IC topology and layout, routing, CMOS technology design kits.
6. Modern sub-micron IC technologies, Silicon on Insulator (SOI) technology, Strained silicon technology, Radio Frequency ICs, multilevel metallization (dual Damascene), fin FET technology.
7. CAD tools for the design of integrated circuits, IC circuit simulations analysis (DC, Transient, AC, Noise, PSS, PAC), testing and diagnostics. Design methodologies of digital, analog and mixed integrated systems.
8. Design of Analog Integrated System - technological requirements, concept of analog design and hierarchical structure (Hierarchy editor) models and libraries for analog blocks; Layout and ICs topology, design rules, parasitic structures and parasitic extraction.
9. Digital integrated system technology requirements, specifications and abstraction methods Digital design methodologies. IC technology (Design Kit) selection, Hardware Description Language HDL, Synthesis.
10. Digital circuit Physical Synthesis - chip topology, floorplaning, routing; design rule check, parasitic extraction. Placement of functional blocks, power distribution, clock distribution, chip verification methods.
11. Mixed-signal design methodologies, technology requirements abd design specifications, hierarchical classification, component models for analog and digital blocks.
12. Micro-electro-mechanical systems MEMS - technologies, applications.
13. Testing and diagnosis of integrated systems, design for manufacturing and yield.
14. Reserve
2. Methodology of analog, digital and mixed-signal integrated systems (top down, bottom up), the design abstraction levels, Application Specific Integrated Systems ASIC - principles of ASIC hierarchy, comparing the performance, economics aspects
3. Fabrication integrated circuits processes - materials, wafer preparation, types of lithography (DUV, EUV, electron, X-Ray), etching (plasma, RIE)
4. Fabrication integrated circuits processes - ion implantation, diffusion, epitaxial growth, chemical vapor deposition CVD, PVD, planarization, copper metallization, ICs packaging and testing.
5. The CMOS process technology step by step, IC topology and layout, routing, CMOS technology design kits.
6. Modern sub-micron IC technologies, Silicon on Insulator (SOI) technology, Strained silicon technology, Radio Frequency ICs, multilevel metallization (dual Damascene), fin FET technology.
7. CAD tools for the design of integrated circuits, IC circuit simulations analysis (DC, Transient, AC, Noise, PSS, PAC), testing and diagnostics. Design methodologies of digital, analog and mixed integrated systems.
8. Design of Analog Integrated System - technological requirements, concept of analog design and hierarchical structure (Hierarchy editor) models and libraries for analog blocks; Layout and ICs topology, design rules, parasitic structures and parasitic extraction.
9. Digital integrated system technology requirements, specifications and abstraction methods Digital design methodologies. IC technology (Design Kit) selection, Hardware Description Language HDL, Synthesis.
10. Digital circuit Physical Synthesis - chip topology, floorplaning, routing; design rule check, parasitic extraction. Placement of functional blocks, power distribution, clock distribution, chip verification methods.
11. Mixed-signal design methodologies, technology requirements abd design specifications, hierarchical classification, component models for analog and digital blocks.
12. Micro-electro-mechanical systems MEMS - technologies, applications.
13. Testing and diagnosis of integrated systems, design for manufacturing and yield.
14. Reserve
Exercises outlines
1. Introduction to work under UNIX and introduction to CADENCE design tools
2. CMOS design kits, simulation of analogue ICs, simulator Spectre.
3. Parameters of logic gates and characteristics of CMOS transmition gate.
4. Analog IC design flow, testbenches
5. Influence of processing variances, Corner analysis, Monte Carlo analysis.
6. Layout of analogue IC.
7. Layout of analogue IC.
8. Design rule check, parasitic extraction.
9. Digital IC design flow, simulations.
10. Synthesis and verification of digital IC design.
11. Design of optic devices for sensors and informatics
12. Design of optoelectronic devices for sensors and informatics, substitute circuits.
13. Principles of optical and optoelectronic IC design
14. Work presentation, final assessment
2. CMOS design kits, simulation of analogue ICs, simulator Spectre.
3. Parameters of logic gates and characteristics of CMOS transmition gate.
4. Analog IC design flow, testbenches
5. Influence of processing variances, Corner analysis, Monte Carlo analysis.
6. Layout of analogue IC.
7. Layout of analogue IC.
8. Design rule check, parasitic extraction.
9. Digital IC design flow, simulations.
10. Synthesis and verification of digital IC design.
11. Design of optic devices for sensors and informatics
12. Design of optoelectronic devices for sensors and informatics, substitute circuits.
13. Principles of optical and optoelectronic IC design
14. Work presentation, final assessment
Literature
https://moodle.fel.cvut.cz/course/view.php?id=2454
Requirements
The students are expected to have a good understanding of the electronic components principle (unipolar and bipolar transistor, etc.) and electronics circuit analysis. Students are expected to have knowledge of modelling and simulation of electronic circuits.
Integrated System Structures - AD2M34SIS
| Credits | 5 |
| Semesters | Winter |
| Completion | Assessment + Examination |
| Language of teaching | Czech |
| Extent of teaching | 14KP+6KC |
Annotation
Design methodologies of analog, digital and optoelectronics integrated systems. Description of integrated circuits fabrication process; CMOS technologies and its modern sub-micron trends; design rules and layout design. Design and fabrication process of micro-electro-mechanical systems (MEMS); polymer based technologies; optical and optoelectronical integrated circuits, fabrication process and technologies, matherials, design and testing.
Study targets
No data.
Course outlines
1. Microelectronics and integrated circuit design history, roadmaps, Moor?s laws, IO design methodologies, current trends.
2. Analogue, digital and mix-signal integrated systems design methodologies (top down, bottom up), design abstraction levels, application specific integrated systems, their types, hierarchy, design economical aspects.
3. Integrated circuits fabrication processes - materials, monocrystal manufacturing, wafers processing, lithography variances, etching.
4. Integrated circuits fabrication processes - ion implantation, diffusion, epitaxial deposition, vapour deposition methods (CVD, PVD), integrated circuits packaging
5. CMOS fabrication process, layout, topological masks, isolation methods, CMOS process variances, interconnection technology.
6. Modern IC technologies, submicron CMOS technologies, silicon on insulator (SOI) technology, Strained silicon technology, RF IC, metallization process (Dual Damascene).
7. Software tools for IC design; simulation, characterization and testing of microelectronics systems; design methodologies of digital, analogue and mix-signal integrated systems. Analysis types (DC, Transient, AC, Noise, PSS, PAC...)
8. Aspects of analogue IC design, technological needs, analogue design levels of abstraction, Hierarchy editor, libraries and models for analogue blocks; layout design, design rules, parasitic structures, parasitic extraction; development of analogue cells library.
9. Aspects of digital IC design, technological needs, specification and abstraction methods of digital IC design. Design kits description, Floorplanning, design of interconnect, place and route, layout - design rules check; parasitic extraction; functional blocks placement, routing of power lines and clock lines, verification.
10. Aspects of mix-signal design, technological needs, design specification, hierarchy levels, libraries for mix-signal design. Methodologies for simulation and connection of analogue and digitals functional blocks.
11. Design and manufacturing processes of micro-electro-mechanical systems (MEMS), fabrication, materials, application; polymeric electronics, application areas.
12. Optoelectronic and optical integrated circuits types, basic principles and phenomenon in their design.
13. Technologies used in integrated optoelectronics and optics, materials, manufacturing process, design of monolitical and hybrid integrated circuits.
14. Optoelectronic and optical integrated circuits types used in informatics applications and sensors design (planar optical dividers, optical multiplexors, optical , optical modulators, planar optoelectronic transceivers, receivers and amplifiers; receivers and amplifiers for WDM and OTDM, etc.
2. Analogue, digital and mix-signal integrated systems design methodologies (top down, bottom up), design abstraction levels, application specific integrated systems, their types, hierarchy, design economical aspects.
3. Integrated circuits fabrication processes - materials, monocrystal manufacturing, wafers processing, lithography variances, etching.
4. Integrated circuits fabrication processes - ion implantation, diffusion, epitaxial deposition, vapour deposition methods (CVD, PVD), integrated circuits packaging
5. CMOS fabrication process, layout, topological masks, isolation methods, CMOS process variances, interconnection technology.
6. Modern IC technologies, submicron CMOS technologies, silicon on insulator (SOI) technology, Strained silicon technology, RF IC, metallization process (Dual Damascene).
7. Software tools for IC design; simulation, characterization and testing of microelectronics systems; design methodologies of digital, analogue and mix-signal integrated systems. Analysis types (DC, Transient, AC, Noise, PSS, PAC...)
8. Aspects of analogue IC design, technological needs, analogue design levels of abstraction, Hierarchy editor, libraries and models for analogue blocks; layout design, design rules, parasitic structures, parasitic extraction; development of analogue cells library.
9. Aspects of digital IC design, technological needs, specification and abstraction methods of digital IC design. Design kits description, Floorplanning, design of interconnect, place and route, layout - design rules check; parasitic extraction; functional blocks placement, routing of power lines and clock lines, verification.
10. Aspects of mix-signal design, technological needs, design specification, hierarchy levels, libraries for mix-signal design. Methodologies for simulation and connection of analogue and digitals functional blocks.
11. Design and manufacturing processes of micro-electro-mechanical systems (MEMS), fabrication, materials, application; polymeric electronics, application areas.
12. Optoelectronic and optical integrated circuits types, basic principles and phenomenon in their design.
13. Technologies used in integrated optoelectronics and optics, materials, manufacturing process, design of monolitical and hybrid integrated circuits.
14. Optoelectronic and optical integrated circuits types used in informatics applications and sensors design (planar optical dividers, optical multiplexors, optical , optical modulators, planar optoelectronic transceivers, receivers and amplifiers; receivers and amplifiers for WDM and OTDM, etc.
Exercises outlines
1. Introduction to work under UNIX and introduction to CADENCE design tools
2. CMOS design kits, simulation of analogue ICs, simulator Spectre.
3. Parameters of logic gates and characteristics of CMOS transmition gate.
4. Analog IC design flow, testbenches
5. Influence of processing variances, Corner analysis, Monte Carlo analysis.
6. Layout of analogue IC.
7. Layout of analogue IC.
8. Design rule check, parasitic extraction.
9. Digital IC design flow, simulations.
10. Synthesis and verification of digital IC design.
11. Design of optic devices for sensors and informatics
12. Design of optoelectronic devices for sensors and informatics, substitute circuits.
13. Principles of optical and optoelectronic IC design
14. Work presentation, final assessment
2. CMOS design kits, simulation of analogue ICs, simulator Spectre.
3. Parameters of logic gates and characteristics of CMOS transmition gate.
4. Analog IC design flow, testbenches
5. Influence of processing variances, Corner analysis, Monte Carlo analysis.
6. Layout of analogue IC.
7. Layout of analogue IC.
8. Design rule check, parasitic extraction.
9. Digital IC design flow, simulations.
10. Synthesis and verification of digital IC design.
11. Design of optic devices for sensors and informatics
12. Design of optoelectronic devices for sensors and informatics, substitute circuits.
13. Principles of optical and optoelectronic IC design
14. Work presentation, final assessment
Literature
Michael Smith: Application-Specific Integrated Circuits, Addison-Wesley, 1998
P. Gray, P Hurst, s. Lewis, R. Mayer: Analysis and Design of Analog Integrated Circuits, John Wiley and Sons, 2000
E. Sinencio, A. Andreou: Low-Voltage/Low-Power Integrated Circuits and Systems, John Wiley and Sons, 1998
Mark Zwolinski : Digital System Design and VHDL , Prentice-Hall, 2000
P. Gray, P Hurst, s. Lewis, R. Mayer: Analysis and Design of Analog Integrated Circuits, John Wiley and Sons, 2000
E. Sinencio, A. Andreou: Low-Voltage/Low-Power Integrated Circuits and Systems, John Wiley and Sons, 1998
Mark Zwolinski : Digital System Design and VHDL , Prentice-Hall, 2000
Requirements
No data.