CTU FEE Moodle
Technology in Electrical Engineering
B232 - Summer 23/24
This is a grouped Moodle course. It consists of several separate courses that share learning materials, assignments, tests etc. Below you can see information about the individual courses that make up this Moodle course.
Technology in Electrical Engineering - B1B13VST
Main course
| Credits | 5 |
| Semesters | Summer |
| Completion | Assessment + Examination |
| Language of teaching | Czech |
| Extent of teaching | 3P+2L |
Annotation
Production systems in electrical engineering will be characterized, their arrangement and basic technologies for mechanical joints and plastic parts. Manufacturing of windings,drying and impregnation processes will also been presented. Next part of a course will be focused on basic technologies for semiconductors including power integration. Beam technologies, technologies using plasma, packaging and basic assembly technologies will also been presented.
Study targets
Students learn basic types of technological processes used in electrical production as well as with basic types of power electronic components and their properties.
Course outlines
1. Basic semiconductor structures. Characteristics, technological possibilities, realizations.
2. Power PIN and Schottky diodes. Static and dynamic parameters. Static and dynamic characteristics. Applications.
3. Current controlled devices. Thyristors (SCR), GTO, GTC, IGCT. Applications.
4. Voltage controlled devices (VDMOS, TMOS). IGBT, Structure and parameters. Applications.
5. Power integration. Power modules, principles, construction, technology. IPM. Cooling. Applications.
6. Beam technology in electrical engineering. Plasma technology in electrical engineering. Technology based on power electrical field.
7. Packaging of components for power electrical engineering.
8. Film technology and film components for power electrical engineering. Rapid prototyping.
9. HF and dielectric heating. Applications.
10. Winding of electrical machines - types, technology, drying, applications
11. Magnetic circuits of electrical machines - types, technology
12. Technology of surface finishes and protective layers.
13. Production systems in electrical engineering, types, arrangement.
2. Power PIN and Schottky diodes. Static and dynamic parameters. Static and dynamic characteristics. Applications.
3. Current controlled devices. Thyristors (SCR), GTO, GTC, IGCT. Applications.
4. Voltage controlled devices (VDMOS, TMOS). IGBT, Structure and parameters. Applications.
5. Power integration. Power modules, principles, construction, technology. IPM. Cooling. Applications.
6. Beam technology in electrical engineering. Plasma technology in electrical engineering. Technology based on power electrical field.
7. Packaging of components for power electrical engineering.
8. Film technology and film components for power electrical engineering. Rapid prototyping.
9. HF and dielectric heating. Applications.
10. Winding of electrical machines - types, technology, drying, applications
11. Magnetic circuits of electrical machines - types, technology
12. Technology of surface finishes and protective layers.
13. Production systems in electrical engineering, types, arrangement.
Exercises outlines
1. Organization of labs, safety in the laboratory, explanation and demonstration of tasks 1 to 2
2. Explanation and demonstration of tasks 3 to 6
3. Vacuum drying and impregnation.
4. Soft soldering in electrical engineering.
5. Joining of power cables.
6. Joining of conductors and cables. Test.
7. Drilling and checking of PC boards.
8. Sputtering and evaporation of thin films.
9. Explanation and demonstration of tasks 7 to 9.
10. Task 7
11. Task 8
12. Task 9
13. Checking of laboratory results.
14. Assessment.
2. Explanation and demonstration of tasks 3 to 6
3. Vacuum drying and impregnation.
4. Soft soldering in electrical engineering.
5. Joining of power cables.
6. Joining of conductors and cables. Test.
7. Drilling and checking of PC boards.
8. Sputtering and evaporation of thin films.
9. Explanation and demonstration of tasks 7 to 9.
10. Task 7
11. Task 8
12. Task 9
13. Checking of laboratory results.
14. Assessment.
Literature
1.Benda, V. et al: Power Semiconductor Devices - Theory and Applications, J. Wiley, 1999
2. Bruce, R. G. et al.: Modern Materials and Manufacturing Processes, Prentice Hall, 2003
3. Pokharel, B. P., Karki, R. N.: Electrical Engineering Materials. Alpha Science, Oxford, 2007
4. Herman, S. L.: Electrical machines and transformers. Cengape Learning. 2012
2. Bruce, R. G. et al.: Modern Materials and Manufacturing Processes, Prentice Hall, 2003
3. Pokharel, B. P., Karki, R. N.: Electrical Engineering Materials. Alpha Science, Oxford, 2007
4. Herman, S. L.: Electrical machines and transformers. Cengape Learning. 2012
Requirements
A student must attend at a practical training and must obtain an assessment before examination. A knowledge of lectured matter and laboratory tasks will be required at examination.
Power components and technology - BD5B13VST
| Credits | 4 |
| Semesters | Summer |
| Completion | Assessment + Examination |
| Language of teaching | Czech |
| Extent of teaching | 14KP+6KL |
Annotation
Production systems in electrical engineering will be characterized, their arrangement and basic technologies for mechanical joints and plastic parts. Manufacturing of windings,drying and impregnation processes will also been presented. Next part of a course will be focused on basic technologies for semiconductors including power integration. Beam technologies, technologies using plasma, packaging and basic assembly technologies will also been presented.
Study targets
Students learn basic types of technological processes used in electrical production as well as with basic types of power electronic components and their properties.
Course outlines
1. Lasers and laser beams as a technological tool. Laser Beam Applications
2. Electron beam as a technological tool. Electron beam sources. Plasma technologies.
3. Thin layers. Use of thin films.
4. Thick layers. Dielectric heating.
5. Induction heating. Technological applications of power electric or current field.
6. Basics of winding technology.
7. Drying in electrical production.
8. Impregnation technology.
9. Technology of power wires and cables.
10. Power diodes, PIN diodes and Schottky diodes. Structure, basic characteristics.
11. Bipolar transistor. Structure, basic characteristics.
12. Current controlled components. Thyristors, switchable components.
13. Voltage-controlled components, MOSFET, IGBT transistor, structure, basic characteristics.
14. Passive components for use in power circuits.
2. Electron beam as a technological tool. Electron beam sources. Plasma technologies.
3. Thin layers. Use of thin films.
4. Thick layers. Dielectric heating.
5. Induction heating. Technological applications of power electric or current field.
6. Basics of winding technology.
7. Drying in electrical production.
8. Impregnation technology.
9. Technology of power wires and cables.
10. Power diodes, PIN diodes and Schottky diodes. Structure, basic characteristics.
11. Bipolar transistor. Structure, basic characteristics.
12. Current controlled components. Thyristors, switchable components.
13. Voltage-controlled components, MOSFET, IGBT transistor, structure, basic characteristics.
14. Passive components for use in power circuits.
Exercises outlines
1. Organization of labs, safety in the laboratory, explanation and demonstration of tasks 1 to 2
2. Explanation and demonstration of tasks 3 to 6
3. Vacuum drying and impregnation.
4. Soft soldering in electrical engineering.
5. Joining of power cables.
6. Joining of conductors and cables. Test.
7. Drilling and checking of PC boards.
8. Sputtering and evaporation of thin films.
9. Explanation and demonstration of tasks 7 to 9.
10. Task 7
11. Task 8
12. Task 9
13. Checking of laboratory results.
14. Assessment.
2. Explanation and demonstration of tasks 3 to 6
3. Vacuum drying and impregnation.
4. Soft soldering in electrical engineering.
5. Joining of power cables.
6. Joining of conductors and cables. Test.
7. Drilling and checking of PC boards.
8. Sputtering and evaporation of thin films.
9. Explanation and demonstration of tasks 7 to 9.
10. Task 7
11. Task 8
12. Task 9
13. Checking of laboratory results.
14. Assessment.
Literature
1.Benda, V. et al: Power Semiconductor Devices - Theory and Applications, J. Wiley, 1999
2. Bruce, R. G. et al.: Modern Materials and Manufacturing Processes, Prentice Hall, 2003
3. Pokharel, B. P., Karki, R. N.: Electrical Engineering Materials. Alpha Science, Oxford, 2007
4. Herman, S. L.: Electrical machines and transformers. Cengape Learning. 2012
5. Schaaf, P.: Laser processing of materials. Springer. 2012
6. Plasma processing, Hephaestus books, 2011
Chopra, K. L., Kaur, I.: Thin films devices applications. Plenum Press, 2011
2. Bruce, R. G. et al.: Modern Materials and Manufacturing Processes, Prentice Hall, 2003
3. Pokharel, B. P., Karki, R. N.: Electrical Engineering Materials. Alpha Science, Oxford, 2007
4. Herman, S. L.: Electrical machines and transformers. Cengape Learning. 2012
5. Schaaf, P.: Laser processing of materials. Springer. 2012
6. Plasma processing, Hephaestus books, 2011
Chopra, K. L., Kaur, I.: Thin films devices applications. Plenum Press, 2011
Requirements
A student must attend at a practical training and must obtain an assessment before examination. A knowledge of lectured matter and laboratory tasks will be required at examination.